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High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 um), smaller vias (<150 um) and capture pads (<400 um), I/O>300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
It has been already mature technology to do PCB boards with PTH half-Moon Through Hole in the edge, but it is still a challenge at how to control the quality for PCB edge plated half-hole after profiling, such as hole wall copper thorn cocked, residual. Those kinds of PCB with a whole row of plated half-hole on the edge usually characterized by relatively small individuals, used for PCB onboard, as sub-PCB for mother board. Those Through Plated Half-Hole used to connect with mother board and components pins. If these semi-plated hole with residual copper, there may cause unsteady soldering, insufficient solder or even short between two foots when plug-in in PCB assembly manufacturing.
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