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AI Servers Driving PCB Material Innovation: BMI Resin as the Key
2025-04-20
With AI chips demanding extreme signal transmission rates, traditional FR-4 substrates can no longer meet requirements. Dongcai Technology's BMI resin material, accounting for over 50% in HDI boards, achieves ±0.05mm lamination accuracy for 16-layer boards. This material has a dielectric constant as low as 2.2±0.05, effectively reducing signal attenuation, and is used by NVIDIA, Huawei, etc., in AI server core boards. The HDI market is expected to exceed $15 billion by 2025, with BMI material demand growing 200%
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