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Laser Drilling Technology: Pushing the Limits of PCB Microvia Processing
2025-04-20
Hitachi's latest laser drilling technology reduces hole diameter to 10μm, 5 times more precise than traditional mechanical drilling. Femtosecond laser enables contactless processing, avoiding mechanical stress damage. In 5G base stations, 16-layer HDI boards with laser blind/buried vias improve signal transmission efficiency by 50% while saving 30% board space.
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